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  • Please prepare the following documents (digital copy) before you fill-in the form:

    1. A recent photo
    2. Transcript
    3. English test result
    4. Certificates of public examinations

    *You are recommended to read through the form before filling in. You may take more than 15 minutes to complete this form. There is no save and resume function for the form. Please make sure you submit your application before you leave your computer/ electronic device. Do not use a public computer/ electronic device to fill-in this form.

     

  • *The internal deadline for students of the Hong Kong Baptist University to apply for the InnoTech Scholarship 2022 is  17 Jan 2023 (Tuesday). Please submit your application before the deadline.

    Please contact Scholarships and Financial Aid Unit (SFA) [email: sfa@hkbu.edu.hk/ phone: 34112311/ https://sa.hkbu.edu.hk/sfa] for details.

  • Read and follow the Application Procedures and Eligibility & Criteria carefully prior to submitting your application. (details) Please note that shortlisted candidates must attend a Selection Interview in March or April (TBC).

  • If no, please click here to select the correct form of your university for application.

  • I. Personal Data:

  • II. Programme Information:

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  • III. Academic Record:

  • *If you do not have Transcript and English test result at this moment, you still can submit your application. Please contact Scholarships and Financial Aid Unit (SFA) to amend your application once your transcript and English test result is ready.

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  • Qualifications and Open Examinations Result

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  • IV. Extra-Curricular Activities and Community Services (secondary school, college and university)

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  • V. Preliminary Indication of University/Institution for Attachment Programme :

  • Please estimate the cost of the Attachment Programmes based on the following items that may covered by the Scholarship:
    1. Tuition and application fee
    2. Accommodation and board
    3. Books and other supplies
    4. Airfare and visa application
    5. Other mandatory cost

     

    *Under the pandemic, the arrangement for Overseas/ Mainland Attachment Programme of the Scholarship may change. Please refer to this page for latest update, or contact Scholarships & Financial Aid Office for details.

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  • VI. Local Internship Programme (Optional):

  • VII. Mentorship Programme:

  • VIII. Statement of Interest

  • Please share:

    (1) your plan of using the scholarship and your innovative project;

    (2) your long-term career aspirations in the field of innovation and technology; and

    (3) how would you contribute for the betterment of our society using your innovation and strength in science and technology.

    (4) your views on the topic and possible actions related to environmental protection or long-term sustainable development in your field of study.

    (maximum 150 words for each part)

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  • IX. Declaration

  • 1. I certify that all the information provided in this application is true and accurate to the best of my knowledge. In the event that any information is found untrue or inaccurate in the future, the Scholarship Secretariat reserves the right to invalidate any application, withdraw the scholarship approved and require any payment made to be refunded.

    2. I agree that information provided in this application will be used and/or disclosed by the Scholarship Secretariat to relevant parties including my institution to process the application as well as for related purposes, such as conducting selection interviews, monitoring of progress, etc.

    3. I understand that if I am awarded the Innovation and Technology Scholarship, I will automatically become a member of "Hub for the Future" programme, which is a talent hub for HSBC Scholars jointly organised by HSBC and HKFYG. The information provided in this application will be used for communications and event promotion purposes of "Hub for the Future".

    4. I've read and agree with the personal information collection statement and privacy policy of HKFYG.

     

    By signing in the space below, you agree with the above declaration. Please print for your records and retain as verification of your application. 

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