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  • Please prepare the following documents (digital copy) before you fill-in the form:

    1. A recent photo
    2. Transcript
    3. English test result
    4. Certificates of public examinations
    5. Other supporting documents (if any)

    *You are recommended to read through the form before filling in. You may take more than 15 minutes to complete this form. There is no 'save and resume' function for the form. Please make sure you have submitted your application before you leave your computer/ electronic device. Do not use a public computer/ electronic device to fill-in this form. Once you have submitted the form, you cannot amend the form anymore.

  • *The internal deadline for students of The Chinese University of Hong Kong to apply for the InnoTech Scholarship 2023 is 29 December 2022. Please submit your completed application form and supporting documents before the deadline.

     

    You are also required to submit a video clip and a CV to complete your application.  Requirements and submission methods of video and CV are available at:

    http://admission.cuhk.edu.hk/assets/oafa/Scholarships/Overseas/inno-2023-Video_CV_requirements.pdf

     

    Please contact the Office of Admissions and Financial Aid of CUHK (Email: sfas@cuhk.edu.hk) for enquiries.

  • Read and follow the Application Procedures and Eligibility & Criteria carefully prior to submitting your application. (details) Suitable candidates are required to attend a selection interview to be held by CUHK in January / February 2023. Shortlisted candidates must attend a Selection Interview by the Scholarship Secretariat in March or April (TBC) in person.

  • If no, please click here to select the correct form of your unviersity for application.

  • I. Personal Data:

  • II. Programme Information:

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  • III. Academic Record:

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  • Qualifications and Open Examinations Result

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  • IV. Extra-Curricular Activities and Community Services (secondary school, college and university)

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  • V. Preliminary Indication of University/Institution for Attachment Programme :

  • Notes:

    1. Please note that the Scholarship period is 1 June 2023 to 31 July 2024. Your Attachment Programme(s) must be within the Scholarship period.

    2. At least one of the Attachment Programmes must take place in Mainland China.

     

    Please estimate the cost of the Attachment Programmes based on the following items that may covered by the Scholarship:
    1. Tuition and application fee (exclude the CUHK tuition fee for exchange programme)
    2. Accommodation and board
    3. Books and other supplies
    4. Airfare and visa application
    5. Other mandatory cost

     

    *Under the pandemic, the arrangement for Overseas / Mainland Attachment Programme of the Scholarship may change. Please refer to this page for latest update, or contact Scholarships & Financial Aid Office for details.

  • Summary of the Attachment Programmes:

    (Please list in chronological order.)

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  • VI. Local Internship Programme (Optional):

  • VII. Mentorship Programme:

  • VIII. Statement of Interest

  • Please share:

    (1) your plan of using the scholarship and your innovative project;

    (2) your long-term career aspirations in the field of innovation and technology; and

    (3) how would you contribute for the betterment of our society using your innovation and strength in science and technology.

    (4) your views on the topic and possible actions related to environmental protection or long-term sustainable development in your field of study.

    (maximum 150 words for each part)

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  • IX. Declaration

  • 1. I certify that all the information provided in this application is true and accurate to the best of my knowledge. In the event that any information is found untrue or inaccurate in the future, the Scholarship Secretariat reserves the right to invalidate any application, withdraw the scholarship approved and require any payment made to be refunded.

    2. I agree that information provided in this application will be used and/ or disclosed by the Scholarship Secretariat to relevant parties to process the application as well as for related purposes, such as conducting selection interviews, monitoring of progress, etc.

    3. I understand that if I am awarded the Innovation and Technology Scholarship, I will automatically become a member of "Hub for the Future" programme, which is a talent hub for HSBC Scholars jointly organised by HSBC and HKFYG. The information provided in this application will be used for communications and event promotion purposes of "Hub for the Future".

     4. I've read and agree with the personal information collection statement and privacy policy of HKFYG.

     

    By signing in the space below, you agree with the above declaration. Please print the form for your records and retain it as verification of your application.

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